A new way to permanently apply metal onto glass by laser ablation was developed at Laser Mark’s Company. Previous through glass ablation efforts did not provide high adhesion and could be easily rubbed off. The Laser Mark’s Company process combines a specific MOPA pulse width to simultaneously couple with the glass surface when vaporizing a sacrificial adjacent metal shim. The vaporized metal fully adheres to the glass that is selectively heated. No stress to the glass is applied and the process works with Brass, Stainless Steel, and even aluminum. Note on the video how the metal can not be removed even by a high pressure erasure. Laser Mark’s Company can do this as a job shop service or design a custom laser system for in-house processing.
Finally, the ability to smoothly laser cut 1 mm thick silicon into complex shapes without high pressure gas and high wattage – high heat processing. Laser Mark’s Company MOPA fiber lasers optimizes pulse energy properties to smoothly etch out a kerf with only a 6 degree angle. Kerf widths are less than 200 microns and net average cutting speed is over 11mm per minute. Laser Mark’s Company can perform this service as a job shop or design a system for your own in house use. Thinner silicon cuts exponentially faster. Higher energy – higher speed roughing cuts are also available.
Finally a Gold marking process that does not remove the plating! Electronic devices are plated with 50 micro inches of Gold over 200 micro inches of Nickel. All previous attempts at laser marking vaporized both Gold and Nickel exposing the base metal Kovar which corrodes. The Laser Mark’s Company “Light Touch” process just kisses the top layer at the point of coupling and then stops reaction. This is why it is critical to define that transition point between reflection and laser coupling. The process is made possible using the magic of Wave Forms on the MOPA fiber lasers. The pulse width is shortened, and the power density is increased such that only the top surface of the gold is ablated. This process is perfect for military, aerospace, and other devices destined for harsh environments. Process is also possible with the new SPI EP-S-J series of lasers