Finally, the ability to smoothly laser cut 1 mm thick silicon into complex shapes without high pressure gas and high wattage – high heat processing. Laser Mark’s Company MOPA fiber lasers optimizes pulse energy properties to smoothly etch out a kerf with only a 6 degree angle. Kerf widths are less than 200 microns and net average cutting speed is over 11mm per minute. Laser Mark’s Company can perform this service as a job shop or design a system for your own in house use. Thinner silicon cuts exponentially faster. Higher energy – higher speed roughing cuts are also available.