Marking and Engraving Across All Industries

New 1 mm Thick Smooth Silicon Cutting at Laser Mark’s Company

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DSC06746Finally, the ability to smoothly laser cut 1 mm thick silicon into complex shapes without high pressure gas  and  high wattage – high heat processing.  Laser Mark’s Company MOPA fiber lasers optimizes pulse energy properties to smoothly etch out a kerf with only a 6 degree angle.   Kerf widths are less than 200 microns and net average cutting speed is over 11mm per minute.  Laser Mark’s Company can perform this service as a job shop or design a system for your own in house use.  Thinner silicon cuts exponentially faster.  Higher energy – higher speed roughing cuts are also available. 

Author: lasermarkscompany

We at Laser Mark's Company are ready to help you with your next project, be it a prototype or large production run. With our vast experience and wide variety of laser technologies, we are able to provide top-notch laser services.

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